6.1 had a very decent packaging story but after blending Momentics with some
Windows innovative packaging ideas I found out my eyebrows rose high. Let me
give you an example. RPX-Lite BSP somehow was promoted to Automotive Bundle.
Now there is no way to upgrade from RPX-Lite version 6.1 to 6.2 if someone
was and is making an industrial controller based on RPX-Lite, and does not
have any intention to pay for Automotive Bundle. After all, RPX-Lite is QNX
only PPC 823 platform, the cheapest and probably the most lightweight
embedded platform in QNX portfolio. I would suggest giving away this BSP
with NC package for the same reason you are now giving NC away.
Another question is why some BSPs are not included in Professional Edition,
but included into bundles, for example, MVP, PrPMC800 and Marvell Discovery
in Networking Bundle. This packaging is confusing: does it mean Networking
Bundle works only on mentioned boards? I hope not. Could I get those BSPs
w/o Networking Bundle? I hope yes.BTW, some BSP are not included into either
package, for example IBM405GP and Broadcom BCM1250. I guess they got lost.
Let me put on my loyal-QNX-user hat and suggest repackaging. It would be
reasonable to return back to platform based packaging as it was in 6.1 For
example, if a customer is PowerPC shop, then that customer is interested in
buying PowerPC BSPs. As PowerPC shop I would like to experiment with as many
as possible PowerPC BSPs and to learn from them. It is hard to expect the
same customer being interested in MIPS. If so, there would be MIPS Bundle
available. The specific niche bundles (Networking, Automotive) would include
specific features. For example, MOST and all related s/w look like a natural
part of Automotive Bundle.
There is another option that is to include all BSPs into PE. I wouldn’t
mind. It is Professional Edition after all